Hi
Recently, the question has been raised whether the actual hole size vs. lead
diameter has anything to do with regards to quality and longevity of the
joint on high power components.
Would more or less solder around the lead increase or decrease the joint
quality and reliability?
Is there a formula that would describe min/max hole size with respect to the
lead diameter in terms of best solderability and longevity of the joint?
Would the power being dissipated by the component had any effect on that
formula?


Any leads, comments are appreciated.

Thanks,
Jerry

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