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June 2001

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Jun 2001 15:25:46 -0500
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Hi Rick! Take a look at the IPC Expo 2001 proceedings - I authored a paper
which contains the details on how we qualified the 43Sn/43Pb/14Bi alloy for
use for a Class 3 use environment. The application was a point solution for
a specific need based on temperature criteria. I would be very curious why
someone would be using the alloy as a "standard" for electronic assembly.

Dave Hillman
Rockwell Collins
[log in to unmask]




Rick Thompson <[log in to unmask]>@IPC.ORG> on 06/08/2001
01:23:36 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Rick Thompson <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  [TN] Low Temp Solder with Bismuth??


Hi,

We have a customer who is using a low-temp solder (43-43-14) which I think
is some alloy containing Bismuth among other things.  The problem we have
is
that no one currently at the company seems to know quite why this was
spec'd
in to the process and I don't have any familiarity with it.

Can anyone offer insight or resources to research this alloy and why I
might
want to use it?

Thanks in advance.


Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

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