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June 2001

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Jun 2001 08:24:07 -0400
Content-Type:
text/plain
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text/plain (71 lines)
try AI Technology, use paste with filler (thermal set)...
www/aotechnology.com
good luck.
                     jk

-----Original Message-----
From: <Peter George Duncan> [mailto:[log in to unmask]]
Sent: June 7, 2001 10:33 PM
To: [log in to unmask]
Subject: [TN] Thin Thermal Pad Materials


Hi, Everyone,

We are working on a conduction-cooled VME SMT board design for an
avionics
application. It requires a 7 degree C thermal gradient from Chip die at
the
board centre to card the edge, which may be impossible, but we're trying
so
I need your advice.

I'm looking for a highly efficient thermal material 0.30mm thick +/-
0.03mm
and a material 0.15mm thick +/- 0.03mm to fill component air gaps and
other
material interfaces. It should have double-sided adhesive, and require
an
absolute minimum attachment pressure.

I cannot find any materials anywhere, myself, that aren't 0.25mm or
0.5mm
or thicker. And there's nothing as thin as 0.15 finished thickness even
in
thermal tapes. We don't want to use greases or anything silicone either.

Any ideas, anyone, as to where I might find a material souce to meet
such
requirements?

TIA for your ever-wonderful ideas.

Pete Duncan

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