Several of my companies PCB's have traces running under components.  For
Horizontal and Vertical Axial Leaded Components IPC-A-610 specifies a
minimum distance for the components to be above the board surface.  Are
there any other "separation" guidelines for Traces Running Under Leaded
Components?  In addition, we also have PCB's w/ traces running under surface
mount chip resistors and capacitors.  Are there any "separation" guidelines
for surface mount?  In particular, is there a guideline for the minimum
width of the ceramic substrate for a SM Chip Resistor or the insulation
characteristics of the substrate?

Any help would be greatly appreciated.

James J. Riling
Hardware Validation Engineer
Union Switch & Signal Inc.
Phone:  (412)688-2926  Fax:  (412)688-2398
Email:  [log in to unmask]

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