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June 2001

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Subject:
From:
Brian McCrory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Jun 2001 08:57:41 -0700
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Alejandro,

Overplating samples prior to encapsulation is a common
metallographic laboratory practice.  The choice of plating is
dependent on the sample.  You should try to choose an overplate
with a contrasting color and of similar hardness to the samples
being sectioned.  We have used both electroless nickel and
alkaline copper strike plating baths depending upon the base
material and plating being evaluated.  You can use proprietary
baths or mix your own, depending upon your laboratory
facilities.  The Metal Finishing Guidebook and Directory is a
good source of plating bath formulations.

It does sound as though you may want to evaluate your mounting
compound.  Even with overplating, if the mounting material does
not exhibit good adhesion to the sample there will be
difficulties in sample preparation.  A slow cure, low shrinkage
mounting material should not pull away from the samples being
sectioned and may be advisable in your case.  Also, be sure the
samples are clean prior to mounting.

 There are several references on metallographic laboratory
practice listed in the notes section (6.5) of IPC-TM-650, Method
2..1.1, Rev. D which is available for download from the IPC web
site.  You might want to review them as well.

Hope this helps.

--
Brian McCrory

Delsen Testing Laboratories, Inc.
1024 Grand Central Ave.
Glendale, CA  91201

Phone:  818 247 4106
FAX:    818 247 4537
email:  [log in to unmask]
URL:    http://www.delsen.com/

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