Hi Alejandro! Here are some possible solutions:

a) Place a thin piece of aluminum or copper against the plated surface of
interest. This segment of metal will help prevent rounding. This method is
only somewhat successful, especially if you can't keep the metal segment
tight against the plated surface.

b) Add a "hardening" material to your mounting compound. Leco, Struers, etc
all sell a type of ceramic filler to add to the mounting compound. This
filler helps prevent edge rounding of the plated surface of interest.

c) Add a thin layer of electroless nickel to the plated surface. Leco,
Struers, etc all sell an electroless nickel kit for use as an overplate to
prevent rounding. This method has worked the best for several of my solder
joint and plating investigations.

Good Luck.
Dave Hillman
Rockwell Collins
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Becerra Alejandro <[log in to unmask]>@IPC.ORG> on 06/05/2001 06:37:41 PM

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Subject:  [TN] Electroplating coating for Metallographic Preparation




Hello to All,
I have had problems in make cross section for analyze the plating in
components
because of the weak encapsulant interface.
I read that this problem can be solved by applying a protective coating to
the sample (i.e. electrolytic plating).
Does anybody know about a procedure to apply this type of plating to
components?
For instance, now I am interested in analyze the plating of the terminals
in some through hole components.
Thanks,

                             Alejandro Becerra

                             Quality Assurance

                 Phone (915) 841-8439, Fax (915) 841-8401

                             [log in to unmask]

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