Hi folks,

We're looking to solder a micro-PGA socket to an existing NSD BGA pad
pattern.  The pins on the micro-PGA socket are round, I don't have the
exact size but for discussion sake say they are half the size (in diameter)
of the BGA pads.   The end of the round socket pins are flat and will butt
against the BGA pad.  Solder should (hopefully) wet fully to the BGA pad
and around the circumference of the pin.  Our BGA is 225 pins and
approximately 1.1 square inch.

Anyone with experience doing this out in Technet-land?  How reliable will a
butt solder joint like this be, say under cyclical temperature and/or
vibration conditions?  We're using a standard FR4 PWB with ENIG finish,
assume socket carrier material has a similar Tce to FR4.

Any insight/comments appreciated!  Thanks.

Best regards,
Gregg Klawson
General Dynamics Communication Systems
Taunton, Massachusetts, USA
mailto:[log in to unmask]

The views expressed are the author's and do not necessarily reflect the
official position of General Dynamics or any of its subsidiaries.

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