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Subject:	Re: Electroplating coating for Metallographic Preparation
From:	"Barmuta, Mike" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 6 Jun 2001 07:25:10 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (65 lines)

Alejandro: You can use electrolytic plating as an overplate but that is
going to require an electrical connection(cathode) to each component, along
with a rectifier, anode, etc. This is difficult to do. I would recommend
using an electroless plating solution instead. This will eliminate all the
electrical connections and plate a uniform layer of metal over the parts.
Typically electroless nickel is used. It will provide you with a hard
overcoat and give a clear clean demarcation of the plating on the
components.
Your supplier of metallograghic equipment should be able to help you in
obtaining the plating solution and proper surface prep, if not contact your
local plating supply rep.


Regards

Michael Barmuta

Staff Engineer

Fluke Corp.

Everett WA

425-446-6076


-----Original Message-----
From: Becerra Alejandro [mailto:[log in to unmask]]
Sent: Tuesday, June 05, 2001 4:38 PM
To: [log in to unmask]
Subject: [TN] Electroplating coating for Metallographic Preparation



Hello to All,
I have had problems in make cross section for analyze the plating in
components
because of the weak encapsulant interface.
I read that this problem can be solved by applying a protective coating to
the sample (i.e. electrolytic plating).
Does anybody know about a procedure to apply this type of plating to
components?
For instance, now I am interested in analyze the plating of the terminals in
some through hole components.
Thanks,


Alejandro Becerra

Quality Assurance

Phone (915) 841-8439, Fax (915) 841-8401

[log in to unmask]

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