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June 2001

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From:
"Creswick, Steven" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Jun 2001 08:17:07 -0400
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My first reaction was not so much ESD, although that may have been the seed
which initiated the sequence.

Looked more like a thermal runaway induced electrical overstress type of
situation.  Difficult to tell without additional detail/pics.

Third and fourth pictures look more like a form of 'sweeping' mechanical
damage (sweeping from right to left damaging the passivation layer (and
metal) over the gate(?) electrode in the center).

The remaining photos appear to have significant foreign material involved,
as well as the normal residues from semi-spontaneous
electrical-plasma-induced decomposition of the circuit.  These were
obviously 'tested' to detect failure.  The test system IS switching
correctly, I assume

IMHO

Steve Creswick
Gentex Corp

-----Original Message-----
From: Stephen R. Gregory [mailto:[log in to unmask]]
Sent: Tuesday, June 05, 2001 9:05 PM
To: [log in to unmask]
Subject: Re: [TN] UGLY PHOTOS AND FAILURE ANALYSIS OPINIONS NEEDED


Hey Moonman!

'Kay, all the pictures are up!! Go to:

http://stevezeva.homestead.com/index.html

I think I was a little off when I said 15-minutes...I forget that I don't
have a T1 line at home like I do at work! 56k modems aren't quite as fast as
a T1...plus you don't get bumped off Ti's like you do on AOL
dial-ups...hehehe.

But they're there now, all the pictures are labeled ESD/EOS damage...GREAT
pictures Earl!! Wish I knew enough about this stuff to offer some
input...it'll be a real learning experience to hear from those that do!!!

-Steve Gregory-

<< Folks,

 In this message, I ask Steve to tell me his requirements for posting
 pictures to his site. The photos show component failure at my new contract
 company.

 Of primary concern is ESD/EOS failure. Also of concern is excessive thermal
 excursions and the inability, possibly to get the heat out. Some reasons
for
 this conclusion involve coplanarity issues not allowing intimate contact
 with the heat sink and the company's requirement of not filling the void
 with thermal goop. Too messey they say.

 My humble conclusion is the part is too ESD/EOS sensitive for the
commercial
 assembly operation hired to do the job. Contributing to the many failures
is
 the the thermal issue.

 I appreciate any input from you component failure analysis folks. If you've
 seen anything like this before, please let me know.

 For now, this issue is secret with respect to the supplier (guess who as a
 GaAs amplifier supplier) and the customer for it (my employee). Their
 customer is one of the folks involved with, what else, broadband
 communications.

 The photos will be presented on Steve's site with his permission and
 procedures. This might not happen until tomorrow, depending on available
 time and resources.

 Thanks,

 MoonMan >>

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