Hello, Earl!
These pictures show in my opinion ESD/EOS failures.
The second and third pictures, which show minute damage of the conductor , are characteristic
for ESD failure.
After the damage due to ESD, the component may experience further damage with more drastic
consequences , as in the other pictures.
I hope that the damage did not occur DURING electrical test, I was at that picture too.
Hope it helps,
Gaby
Earl Moon wrote:
> Folks,
>
> In this message, I ask Steve to tell me his requirements for posting
> pictures to his site. The photos show component failure at my new contract
> company.
>
> Of primary concern is ESD/EOS failure. Also of concern is excessive thermal
> excursions and the inability, possibly to get the heat out. Some reasons for
> this conclusion involve coplanarity issues not allowing intimate contact
> with the heat sink and the company's requirement of not filling the void
> with thermal goop. Too messey they say.
>
> My humble conclusion is the part is too ESD/EOS sensitive for the commercial
> assembly operation hired to do the job. Contributing to the many failures is
> the the thermal issue.
>
> I appreciate any input from you component failure analysis folks. If you've
> seen anything like this before, please let me know.
>
> For now, this issue is secret with respect to the supplier (guess who as a
> GaAs amplifier supplier) and the customer for it (my employee). Their
> customer is one of the folks involved with, what else, broadband
> communications.
>
> The photos will be presented on Steve's site with his permission and
> procedures. This might not happen until tomorrow, depending on available
> time and resources.
>
> Thanks,
>
> MoonMan
>
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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
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