Guy,

The effect of lowering the pressure to remove moisture inside a plastic
package has already been investigated by component manufacturers. The intent
was to reduce or minimize the duration of the bake cycles. I can refer you
to the following technical paper for more details :

Dry-Pack and Demoisturizing Process Improvements Breaking the Bake-Out
Bottleneck, Charles Leech, Altos Engineering, Inc. Semiconductor Packaging
Symposium - Session VIII, Semicon West 1999.

Francois Monette
Cogiscan Inc.
50 De Gaspe, Suite A5
Bromont, Quebec, Canada, J2L 2N8
Tel : (450)534-2644
Fax: (450)534-0092
www.cogiscan.com

> -----Original Message-----
> From: Guy Ramsey [mailto:[log in to unmask]]
> Sent: Thursday, May 24, 2001 12:44 PM
> To: [log in to unmask]
> Subject: [TN] Moisture Sensitive Components
>
>
> Anyone out there ever considered dring moisture sensitive devices by
> lowering the pressure in a storage vessle?
>
> It is difficult to achieve 40°C and less than 5%RH when ambient
> RH is 50-60
> percent. So, someone called and asked how long he would need to keep the
> parts at a pressure equivelent of 80,000 ft above sea level,
> temperature at
> room ambient to dry out parts.
>
> No one here had considered it before. The physics made me feel
> like I was at
> altitude.
>
> Guy Ramsey
> Senior Lab Technician / Instructor
>
>
> E-Mail: [log in to unmask] <mailto:[log in to unmask]>
> Ph: (610) 362-1200 x107
> Fax: (610) 362-1290
>

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