TECHNET Archives

June 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Bissonnette, Jean-Francois" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Jun 2001 13:16:12 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (76 lines)
Interesting this measling issue...

What if these boards are to be used in an environment where
temperature and humidity are subject to change (big changes)?  And can you
be sure boards like that can be coated without entrapping humidity?

Just some thoughts...

JF

> -----Original Message-----
> From: Sauer, Steven T. [mailto:[log in to unmask]]
> Sent: Tuesday, June 05, 2001 12:45 PM
> To: [log in to unmask]
> Subject: Re: [TN] Measling...
>
>
> Hi Steve,
> Sorry about the tardy response but to answer your question
> I'll use one
> word, "NO."
> The image depicts a classic case of measling, characterized
> by distinct
> white spots (which have always showed up quite nicely on polyimide
> substrates) contained within the knuckle of the weave and
> does not reduce
> the distance between adjacent conductors on the same plane by
> less than 50%.
> As you stated, the assembly was supposedly baked prior to
> rework..., one
> more observation is that the operator also supposedly
> staggered the rework
> by not reworking adjacent DIP leads one after the other.
>
> Steve Sauer
> Mfg. Engineer
> Xetron Corporation
>
> -----Original Message-----
> From: Stephen R. Gregory [mailto:[log in to unmask]]
> Would any of you have any REAL hesitation about accepting
> this assembly?
>
> --------------------------------------------------------------
> -------------------
> Technet Mail List provided as a free service by IPC using
> LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with
> following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following
> message: SET Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources
> & Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm)
> for additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> --------------------------------------------------------------
> -------------------
>


WABTEC CORPORATION CONFIDENTIALITY NOTE
The content contained in this e-mail transmission is legally privileged and confidential information intended only for the use of the individual or entity named herein. If the reader of this transmission is not the intended recipient, you are hereby notified that any dissemination, distribution, or copying of this transmission is strictly prohibited.

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2