TECHNET Archives

June 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Sauer, Steven T." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Jun 2001 12:45:24 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Hi Steve,
Sorry about the tardy response but to answer your question I'll use one
word, "NO."
The image depicts a classic case of measling, characterized by distinct
white spots (which have always showed up quite nicely on polyimide
substrates) contained within the knuckle of the weave and does not reduce
the distance between adjacent conductors on the same plane by less than 50%.
As you stated, the assembly was supposedly baked prior to rework..., one
more observation is that the operator also supposedly staggered the rework
by not reworking adjacent DIP leads one after the other.

Steve Sauer
Mfg. Engineer
Xetron Corporation

-----Original Message-----
From: Stephen R. Gregory [mailto:[log in to unmask]]
Would any of you have any REAL hesitation about accepting this assembly?

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2