I am a little confused about BGA voids and reliability.

How many field returns per year do we collectively see? My experience over
the last several years was 0. Don't recall ever seeing one.  But we all
build to specs that mathematically predict some defects. So where are they?

So it  must meaqn the spec requirements are excessively tight. The
characteristic life curves I developed showed that assemblies are
incredibly robust.  Of course, that is using the accepted acceleration
factors.

Which is my point. Why can't we use realistic (or better-experimentally
defined) limits? I  have run assemblies beyond 1K cycles (of -45C to 85C)
with 70% voids and seen no failures. I am talking millions of joints in
many package styles.

Is there any industry group looking at this kind of problem?

Steve

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