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June 2001

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Subject:
From:
"Furrow, Robert Gordon (Bob)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 29 Jun 2001 09:20:45 -0400
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We began testing immersion silver formulations in 1997. At the time, we
approved one for use and rejected another. The second formulation was
subsequently reformulated and has now been approved for use. We have been
building product in volume since 1999 and other than a couple of quickly
resolved supplier issues, have had excellent success with immersion silver.
This experience extends over more than a million circuit packs and the
technologies have ranged the whole gamut from single sided reflow to double
sided reflow with selective wave solder, and subsequent hand solder. In most
of our locations we are using no clean pastes and fluxes which are
relatively nonaggressive. Immersion silver is the coating of choice for many
of our facilities. One issue that needs attention is testability. In circuit
testing of ImAg (if you don't solder all the test points)is similar to
OSP's. In both cases you are penetrating to the relatively hard copper
rather than into the much softer solder of HASL (or solder from SMT or
Wave). With proper selection of probes and adequate force, this has not been
an issue for us.

Thanks,
Robert Furrow
Printed Wiring Board Engineer
Strategic Supply Global Account Manager
Supply Chain Networks
Lucent Technologies
978-960-3224    [log in to unmask]


-----Original Message-----
From: Bruce Bryla [mailto:[log in to unmask]]
Sent: Friday, June 29, 2001 6:41 AM
To: [log in to unmask]
Subject: [TN] Immersion Silver


I am looking to transition from immersion tin to immersion silver for PWB's.

I would be interested in receiving comments/information from users and their

experiences, both positive and negative.

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