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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 29 Jun 2001 08:59:49 +0800 |
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X-ray, and 100% as these are military boards. It doesn't tell you how GOOD
the joints are but it tells you that the BGA is located correctly, that the
solder joints are complete and that there is no bridging. I've yet to come
across a scope that can see past more than the first two rows of contacts,
and even then the view is pretty limited.
You might consider ultrasonic inspection if you don't like X-ray, but
visual inspection wouldn't be enough for our application. If you're more
commercial, and you're confident that your process is controlled and
repeatable, and you have been getting reliable product, then batch sampling
and X-raying is all you need. You sample size and frequency will depend on
product volume and experienced failure rates.
Pete Duncan
Rick Howieson
<RHowieson@DELTAGRO To: [log in to unmask]
UPINC.COM> cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Sent by: TechNet Subject: [TN] BGA
<[log in to unmask]>
06/29/01 01:36 AM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to Rick
Howieson
For the folks out there doing BGA assembly, do you use x-ray for inspection
and if so, how often. I'm curious whether we need to purchase x-ray or a
scope that allows side viewing.
Thanks,
Rick Howieson
Delta Group Electronics, Inc.
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