Hi

HASL and OSP coatings are used to prevent copper oxidation on the solderable
areas prior to component placement and soldering.

The only reason for using OSP is to achieve better co-planarity, i.e. a flat
surface for the teensy weensy SMT devices to be placed upon.

The protection against oxidation from OSP isn't as good as with HASL,
subsequently the solderability can suffer, however if applied properly the
OSP should give satisfactory storage and subsequent solderability.

Andrew Hoggan
BBA Associates
www.bba-associates.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Cormac MacMahon
Sent: Thursday, June 28, 2001 5:57 PM
To: [log in to unmask]
Subject: [TN] **** PCB's - HASL -v- OSP


Folks,

I am an NPI Engineer at Artesyn technologies and I am new to the Surface
Mount
Technology. Can anyone shed some light on the differences between HASL and
OSP.
We are currently using HASL but are looking at migrating to OSP. What are
the
pros and cons of one over the other? What sort of processing issues do we
see
with OSP on SMT lines?

Any help appreciated
Cormac MacMahon

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------