Hello Guys,

 What is the best cooling down rate in a reflow oven?
 Does anybody have experience on what maximum cooling down rate
that will not result in Silicon cracking?
We have some silicon cracking (Chips) and we are still evaluating
if fast cool down can cause this problem.
My Profile is:
Pre-heat: 150 C
Soak: 250 C
Reflow 1: 290 C
Reflow 2: 290 C
Time of Reflow: 180 secs

Thank you very much in advance for your ideas tomorrow

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