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June 2001

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Subject:
From:
"Roger M. Stoops" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 27 Jun 2001 12:40:18 -0400
Content-Type:
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text/plain (142 lines)
You may be thinking of Flourovent.  If interested, more on blood
substitutes at http://www.med.unipi.it/patchir/bloodl/bmr/artif.htm#s2.
Roger M. Stoops, C.I.D., PCB Designer






                    Jason Gregory
                    <Jason.Gregor        To:     [log in to unmask]
                    [log in to unmask]>           cc:
                    Sent by:             Subject:     Re: [TN] How do you reflow?
                    TechNet
                    <[log in to unmask]
                    ORG>


                    06/27/01
                    11:51 AM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum.";
                    Please
                    respond to
                    Jason Gregory





Hi all,
In a previous incarnation, I used and researched the vapor phase process.
Yes, there are still companies marketing vp equipment and fluids. Where I
worked, we needed a stable reflow medium that gave our boards ultimate heat
transfer across the board. Vapor phase gave us this. The deltas measured
were shockingly tight as compared to Convection reflow. I was truly amazed
at the results we saw. (Larry Tawyea can back me up on this). Also, yes,
the fluids are amazingly expensive. At around $1000.00 a gallon, that is
pricy. 3M makes Fluorinert, I believe. Also, Galden makes some. There are
more, but I can't remember. I remember hearing that Fluorinert is approved
as a blood substitute for open-heart surgeries, that's kinda weird. All in
all, with the high-temp, down-hole stuff we were building, the criticality
of having ultimate thermal dispersion across the assy. was achieved with
vapor phase. As for laser soldering, I've no experience. Hope this helps.


Jason Gregory
Software Specialist - NPI Group
SCI Systems/Plant 2
13000 S. Memorial Pkwy.
Huntsville, AL. 35803
(256) 882-4107 x3728
[log in to unmask]

>>> [log in to unmask] 06/27/01 09:28AM >>>
Werner brings up an interesting point. Does anyone have an opinion on the
trends in solder reflow in the contract assembly industry? Are we seeing a
resurgence in vapor phase? Has flowing nitrogen during infrared fallen to
the wayside? Interested in seeing your responses.

Best Regards,
Craig



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Thursday, May 31, 2001 1:19 PM
To: [log in to unmask]
Subject: Re: [TN] AW: [TN] Pad in Via for BGA's - Part II


Hi Rush,
Vapor phase soldering was and is thew most elegant engineering solution to
soldering--no over-temperatures, no profiles, absolute temperature
uniformity. What killed this approach in the past was inadequate
equipment--thhis is no loger a problem.

Werner Engelmaier

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