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June 2001

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Subject:
From:
Peter Swanson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 27 Jun 2001 16:45:15 +0100
Content-Type:
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text/plain (104 lines)
Craig,

The SMART Group ran a small survey on this recently -
http:www.smartgroup.org, click on surveys on the left menu bar, I think
it was Jan this year. It wasn't CEM-specific, nor very detailed. Maybe
future surveys will elaborate.

Regards,
Peter
--
=========================================================
Peter Swanson            [log in to unmask]
INTERTRONICS                http://www.intertronics.co.uk

INTERTRONICS is dedicated to providing quality material,
  consumable and equipment solutions to the electronics
manufacturing and other technology based industries, with
   the highest levels of technical support and customer
                         service.


-----Original Message-----
From: Craig Hillman [mailto:[log in to unmask]]
Sent: 27 June 2001 15:28
To: [log in to unmask]
Subject: [TN] How do you reflow?


Werner brings up an interesting point. Does anyone have an opinion on
the
trends in solder reflow in the contract assembly industry? Are we seeing
a
resurgence in vapor phase? Has flowing nitrogen during infrared fallen
to
the wayside? Interested in seeing your responses.

Best Regards,
Craig



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Thursday, May 31, 2001 1:19 PM
To: [log in to unmask]
Subject: Re: [TN] AW: [TN] Pad in Via for BGA's - Part II


Hi Rush,
Vapor phase soldering was and is thew most elegant engineering solution
to
soldering--no over-temperatures, no profiles, absolute temperature
uniformity. What killed this approach in the past was inadequate
equipment--thhis is no loger a problem.

Werner Engelmaier

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