Having used the vapor phase process in the past (1983 - 1995), I can only
say that nothing is more convenient than forced air convection reflow.
True, V.P. was a forgiving process... nothing generally went wrong, except
the equipment.  Let's not forget the cost of the Flourenert (spelling?).  I
didn't think anyone was still marketing V.P. equipment.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879



        -----Original Message-----
        From:   Craig Hillman [SMTP:[log in to unmask]]
        Sent:   Wednesday, June 27, 2001 10:28 AM
        To:     [log in to unmask]
        Subject:        [TN] How do you reflow?

        Werner brings up an interesting point. Does anyone have an opinion
on the
        trends in solder reflow in the contract assembly industry? Are we
seeing a
        resurgence in vapor phase? Has flowing nitrogen during infrared
fallen to
        the wayside? Interested in seeing your responses.

        Best Regards,
        Craig



        -----Original Message-----
        From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
        Sent: Thursday, May 31, 2001 1:19 PM
        To: [log in to unmask]
        Subject: Re: [TN] AW: [TN] Pad in Via for BGA's - Part II


        Hi Rush,
        Vapor phase soldering was and is thew most elegant engineering
solution to
        soldering--no over-temperatures, no profiles, absolute temperature
        uniformity. What killed this approach in the past was inadequate
        equipment--thhis is no loger a problem.

        Werner Engelmaier


----------------------------------------------------------------------------
        -----
        Technet Mail List provided as a free service by IPC using LISTSERV
1.8d
        To unsubscribe, send a message to [log in to unmask] with following
text in
        the BODY (NOT the subject field): SIGNOFF Technet
        To temporarily halt delivery of Technet send the following message:
SET
        Technet NOMAIL
        Search previous postings at: www.ipc.org > On-Line Resources &
Databases >
        E-mail Archives
        Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
        information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700
        ext.5315

----------------------------------------------------------------------------
        -----


----------------------------------------------------------------------------
-----
        Technet Mail List provided as a free service by IPC using LISTSERV
1.8d
        To unsubscribe, send a message to [log in to unmask] with following
text in
        the BODY (NOT the subject field): SIGNOFF Technet
        To temporarily halt delivery of Technet send the following message:
SET Technet NOMAIL
        Search previous postings at: www.ipc.org > On-Line Resources &
Databases > E-mail Archives
        Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
        information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315

----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------