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Subject:	BGA package warpage characterization
From:	LI YUAN <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 26 Jun 2001 12:08:27 -0600
Content-Type:	TEXT/PLAIN
Parts/Attachments:	TEXT/PLAIN (20 lines)

Are there any papers or literatures which describe how to characterize BGA
warpage in a user environment? I am interested in the PCB structure and
type of ICs used, how they were populated, etc.,  which should reflect
typical user conditions.  Is there a well accepted set of conditions for
this purpose?

Thanks,

Yuan

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