Hi Chuck,

What system are you using?

The guys at Advanced Plasma Systems (APS) are the ones claiming that
moisture is inhibiting a good desmear on some boards that were sent out.
You'd think the folks making the system would know how to optimize their
system.

Hans

-----Original Message-----
From: Chuck Brummer [mailto:[log in to unmask]]
Sent: Monday, June 04, 2001 2:35 PM
To: [log in to unmask]
Subject: Re: [TN] Moisture Absorption & Plasma Desmear


Hans,

I have two words for you:  Vacuum Oven.
We bake in vacuum at 165 F. in 28 to 29 inches of vacuum for 30 minutes.

Works well here.

Chuck Brummer
[log in to unmask]


Hans Hinners wrote:

> Hi All,
>
> What's the industry rule of thumb for prepping pwbs for plasma desmear?
>
> Do you bake (dry) prior to plasma or do you just do an extended vacuum
> segment at the beginning?
>
> The panels are 142 mils and the plasma house says they can't get the
> required etchback because of moisture.
>
> Hans
>
> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
> Hans M. Hinners
> Process Engineer
> Toppan Electronics, Inc.
> 770 Miramar Road
> San Diego, CA 92126
> (858) 695 - 2222 ext. 241
> (858) 695 - 6823 fax
> [log in to unmask]
>
>
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