Hi all,

As part of our ISO-9001 effort we need to validate some of our processes.
Specifically wave solder, crimping, pwb cleaning and encapsulating.  Did I
miss any?

To validate wave solder do I need to micro-section a sample board and look
at it with a microscope or SEM?  If I have to micro-section a "sample"
board, how do I do that without destroying the pad I'm cutting through?  Yet
another piece of equipment?

For crimps it would be a pull test.  Any equipment suggestions?

For PWB cleaning it would be an ionic test.  What equipment would be used?

For encapsulation it would have to be a destructive test to saw it apart and
inspect the cross section and maybe a hardness test to confirm that the
ratios provided the proper cure hardness.

I'm open to suggestions.  Keep in mind that management will laugh if I bring
in requisitions for hundreds of thousands of dollars.  We like the "keep it
simple" approach.

Thanks in advance.

Phil Nutting
Manufacturing Engineer
Kaiser Systems, Inc.

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