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June 2001

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From:
"Mengers, William D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Jun 2001 12:25:14 -0400
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Thanks Howard.

        -----Original Message-----
        From:   Howard Watson [SMTP:[log in to unmask]]
        Sent:   Thursday, June 21, 2001 11:58 AM
        To:     [log in to unmask]
        Subject:        Re: [TN]


        Bill,

        Like yourself, I too am doing a solder paste evaluation, and am
nearing completion.  To answer your question on age or freshness of paste,
it may not be an issue, but you may want to get all fresh samples and
evaluate them fairly, and if you desire, let them sit for a month or so to
evaluate their performance with age.  That's what I did, but did not notice
any performance difference with age.  I have heard that when paste sits in
its container at room temperature, the solder tends to settle towards the
bottom, but I have not seen evidence of this.  I have had paste sit at my
desk for 3 months and it performed great, though your environment will
likely be different than mine.

         As far as whether or not you should make a science project out of
this, I would say "yes", by all means.  If you don't, you probably won't
choose a "bad" solder paste, but you might not choose the "best" for your
needs.  By the way, I used a fractional factorial DOE checking for response
variables such as wetting, bridging, solder balls and other items that you
mentioned.  I found that all the pastes I tried were very good, but there
was one (EFD 576D) that was exceptional with regards to eliminating solder
balls, or more correctly, solder "beads", which for us is a sporadic and
troublesome problem.  Good luck, and I hope to hear more of your evaluation.


        Howard Watson
        Manufacturing Engineer
        AMETEK/Dixson



                "Mengers, William D." <[log in to unmask]>
        Sent by: TechNet <[log in to unmask]>

        06/21/01 06:55 AM
        Please respond to "TechNet E-Mail Forum."; Please respond to
"Mengers, William D."

                To:        [log in to unmask]
                cc:
                Subject:        [TN]



        Fellow Techies,

        We are getting ready to do a somewhat "extensive" solder paste
evaluation
        for an SMT operation.  What to do seems fairly straight forward
using
        "standard" tests (wetting, solder ball, slump, etc.), but a concern
I have
        is age and relative age of the different pastes we are testing.  In
        practice, we generally use paste within three months of the date
        manufacture, so the paste we use is anywhere from one to three
months old.
        Manufacturers claim good performance for the paste until expiration
of shelf
        life, but I suspect there could be a difference in performance
between fresh
        paste and 6 month old paste.  Maybe not for all pastes, but probably
for
        some.  My question is, at what age should we test the paste, and
does it
        matter (significantly?) if some pastes are fresh and others are
close to 6
        months old, or am I sweating the small stuff by even being concerned
about
        this?

        The pastes we will be testing are no-clean formulations, eg. Alpha
LR737, UP
        78N, Omnix 5000, Indium NC-SMQ92J, AIM NC 251, Heraeus SC3401HTP,
Kester
        Easy Profile 256, and Qualitek 691A.

        Do we really need to make a science project out of this or should we
just go
        with something that is popular for the type of application we have
and see
        if it works on our hardware as long as it meets the standard (J-Std)
we are
        using?

        Any ideas?  Thanks for any responses you give.

        Bill Mengers
        Process Engineer
        Northrop Grumman Corp.
        Baltimore, Md.


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