Lon,

Sounds like the Epoxy may be shrinking during cool down and separating from
PLCC.  The PLCC may have a mold release agent still left on, which can cause
this problem.  Usually though a mold release contaminant will keep the part
from sticking to the PWB.

1. Do you have any voids in the glue dot?
2. Is the glue dot on PWB show a flat,(where the PLCC made Contact)?
3. Have you had any problems before?
4. Are you curing or curing and reflowing?
5. Epoxy Shelf life is still valid?



Tom Braswell
Fawn Industries
6441 East NC 97
Elm City, NC 27822
Ph: (252) 977-8745
Fx: (252) 977-3477
Email: [log in to unmask]

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Lon Weffers
> Sent: Thursday, June 21, 2001 8:50 AM
> To: [log in to unmask]
> Subject: [TN] FW: dispensing glue
>
>
> Dear technetters,
>
> One of my colleges has a problem with glueing a plcc on the solderside of
> the pcb.
> They glue with a Hereaus glue and when they check the joint directly after
> the oven it is stuck.
> When the pcb's are cooled down the component falls of the board.  The glue
> spot is on the board.
> What causes this problem??
>
>
> Lon Weffers
> Matas Electronics bv
> www.matas.nl
>
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