Genny,

I am not sure which type of components you have on the product, but post
process soldering of an RA cored wire could feasible leave residue behind
that cannot be readily cleaned (if you are reworking near a BGA, and flux is
trapped under the BGA).  Moving to a no-clean product like the Kester 245
clux-core wire might be a good idea if it is feasible.  There will be a
learning curve with production, but if the components and boards have decent
solderability, the touch up people should be able to adapt to the additional
skill (speed) necessary a for no clean touch up process.

Steve Abrahamson

> -----Original Message-----
> From: Genny Gibbard [SMTP:[log in to unmask]]
> Sent: Monday,June 18,2001 11:25 AM
> To:   [log in to unmask]
> Subject:      [TN] No Clean and Rosin core on same PCB
>
> Hello,
> We have CM's that use no-clean solder paste on our PCB's.  We have not
> given
> the CM any spec other than that it be approx. 60/40 tin-lead.  In house,
> however, for hand assembly we have always used solder such as Kester "44"
> RA
> core solder.  We're working on a new OEM product and the customer has
> expressed concerns about mixing the two on the same PCB.  We also use a
> safety wash board cleaner.
> Any thoughts or concerns that we should address?
>
> Genny Gibbard (mailto:[log in to unmask])
> Product Transition and Support
> Wavecom Electronics Inc.
>
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