We rely on process control for our BGA attachment.  The solder paste process
is monitored for thickness and uniformity of deposits.  As long as the
proper amount of paste is applied, the placement is accurate (vision
assisted) and the reflow process is in control, then there should be no
reason to x-ray, especially since x-ray will only show bridging,
mis-alignment or missing solder.  We only x-ray when we have a test failure.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>


        -----Original Message-----
        From:   Phil Bavaro [SMTP:[log in to unmask]]
        Sent:   Tuesday, June 19, 2001 1:01 PM
        To:     [log in to unmask]
        Subject:        [TN] BGA Xray Inspection:  100% or SPC controlled

        Here is a question that many of you have had to deal with.......

        Do you xray image inspect 100% of your BGA solder connections

        or

        do you only process a sample of your production volumes thru xray

        or

        do you not require xray inspection unless a test failure occurs on
the board?


        We have bgas on close to all of our boards these days and even with
        inline automatic xray equipment, it is becoming a bottleneck for
        production.

        I hesitate to release my xray inspection control on anything but
        extremely high yielding boards unless there is very high functional
        test coverage to ensure that we don't let bad product out of our
        facility.

        I am just wondering what the rest of the industry has adopted as a
        policy for this problem.

        Thanks in advance.

        Phil

        Phillip A. Bavaro
        QUALCO/\/\/\/\  Incorporated
        Manufacturing Engineer, Staff
        [log in to unmask]
        Cell (619) 602-8644 (offsite, after hours)
        Pager (619) 271-3640
        Tel (619) 658-2542 Office/voice mail
        Cell (619) 845-9968 (workday)
        Fax (619) 658-1584


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