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June 2001

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Subject:
From:
"Kasprzak, Bill (sys) USX" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 19 Jun 2001 09:56:44 -0400
Content-Type:
text/plain
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text/plain (75 lines)
Bill:

I have used Heraeus PD8600002 which meets all of your criteria. One of the
most important characteristics that it has is the ability to leave the
material in my Camalot dispenser for literally weeks before a clean out is
needed!

Bill Kasprzak
Moog Inc., Electronic Assembly Engineering


> -----Original Message-----
> From: Mengers, William D. [SMTP:[log in to unmask]]
> Sent: Tuesday, June 19, 2001 9:03 AM
> To:   [log in to unmask]
> Subject:      [TN] SMT adhesive
>
> Hi All,
>
> I am looking for an SMT adhesive with the following characteristics:
>
> 1.      1 part
> 2.      Dispensible
> 3.      Thermal (not sure of a number here)
> 4.      Snap cure (re-flow)
> 5.      Re-workable
> 6.      Extended work life (prefer several days)
> 7.      Will not lift parts during cure in re-flow oven)
>
> Please tell me I'm not asking for much.  We are presently using LocTite
> 3615
> which dispenses great, but happens not to be a "thermal" adhesive and is
> not
> reworkable.  And, unfortunately, we have not matured enough to learn from
> our mistakes and get rid of re-work.  Or even keep it to a minimum, but
> that
> is a story in itself.
>
> I would like to "stick" with a large company with plenty of resources,
> e.g.
> LocTite.  Any reccommendations?
>
> Thanks for any info you can give,
>
> Bill Mengers
> Process Engineer
> Northrop Grumman Corp.
> Baltimore, Md.
>
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