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June 2001

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Subject:
From:
"Mengers, William D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 19 Jun 2001 09:03:26 -0400
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Hi All,

I am looking for an SMT adhesive with the following characteristics:

1.      1 part
2.      Dispensible
3.      Thermal (not sure of a number here)
4.      Snap cure (re-flow)
5.      Re-workable
6.      Extended work life (prefer several days)
7.      Will not lift parts during cure in re-flow oven)

Please tell me I'm not asking for much.  We are presently using LocTite 3615
which dispenses great, but happens not to be a "thermal" adhesive and is not
reworkable.  And, unfortunately, we have not matured enough to learn from
our mistakes and get rid of re-work.  Or even keep it to a minimum, but that
is a story in itself.

I would like to "stick" with a large company with plenty of resources, e.g.
LocTite.  Any reccommendations?

Thanks for any info you can give,

Bill Mengers
Process Engineer
Northrop Grumman Corp.
Baltimore, Md.

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