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Date: | Tue, 19 Jun 2001 13:37:51 +0100 |
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To answer the question at the simplest level, [no theology on flux types
mixing etc.]:
The no clean will not be as effective as the RA in terms of coping with hard
to solder components, i.e. it will be first to fall over when pushed.
There are several routes to making a no clean flux, so depending on the
chemistry chosen by supplier:
The no clean might not clean properly or at all in the "Safety Wash"
Murphy's Law is raised to a higher potential if you try to repair/rework
uncleaned joints made with one flux type with the other as you will now have
a novel - and unique to you - flux residue. In this instance, if fully
applied, the Law states you will end up with an irremovable RA flux residue.
Mike Fenner
Indium Corporation of Europe
W: www.indium.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Genny Gibbard
Sent: Monday, June 18, 2001 6:25 PM
To: [log in to unmask]
Subject: [TN] No Clean and Rosin core on same PCB
Hello,
We have CM's that use no-clean solder paste on our PCB's. We have not given
the CM any spec other than that it be approx. 60/40 tin-lead. In house,
however, for hand assembly we have always used solder such as Kester "44" RA
core solder. We're working on a new OEM product and the customer has
expressed concerns about mixing the two on the same PCB. We also use a
safety wash board cleaner.
Any thoughts or concerns that we should address?
Genny Gibbard (mailto:[log in to unmask])
Product Transition and Support
Wavecom Electronics Inc.
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