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Subject:	Re: cracking GaAs dice
From:	"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 19 Jun 2001 12:57:13 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (20 lines)

Someone had questions about this issue, forgot what man. However found old paper with a considerably interesting theory:

a) Large voids in bond line >>>reduced thermal conductivity
b) Moderate voids   "         >>>good thermal conductivity, little mechanical stress, no cracks
c) No voids at all     "        >>>good thermal conductivity, high stress, cracks

So, perfectionism may also be a disaster, read article in Solid State Techn  May 1993 p43 etc.

Ingemar

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