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Subject:	Re: ICT Specifications.
From:	Darrel Therriault <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Mon, 18 Jun 2001 08:20:02 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (53 lines)

Stephen,

You can check for probe witness marks, or why not just define a test stamp
requirement?  If your supplier
chooses to stamp them without actually running ICT, I would be looking for a
new supplier.

DT




-----Original Message-----
From: Stephen Brown [mailto:[log in to unmask]]
Sent: Friday, June 15, 2001 6:59 AM
To: [log in to unmask]
Subject: [TN] ICT Specifications.


We have recently had an incident where we feel that we have received a batch
of cards from our assembly house which have by-passed their ICT operation.
This has been determined by the lack of any indentations on the test pads
from the sprung probes.
Are there any specifications which control In Circuit Test operations, such
as spring pressures or the requirement for pin marks on the test pads.

Steve.

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