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Subject:	Re: Dual Side Reflow with A Pallet
From:	Jiang Ping <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 13 Jun 2001 13:57:34 +0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

Hi,

We have a similar board that double side reflow with a pallet.  The pallet actually is a frame with two beams.  There are some support pins on the beams that keep away from bottom components.  When boards are put on the pallet and clamped, the bottom side is not covered, so all the bottom side solder joints are fully reflowed in the oven.  It works very well.

Hope that helps.



Jiang Ping 



----- Original Message ----- 

From: Lefebvre, Scott <[log in to unmask]>

To: <[log in to unmask]>

Sent: Wednesday, June 13, 2001 6:26 AM

Subject: [TN] Dual Side Reflow with A Pallet





> I have an new assembly that is 14"x18" & .093 thick loaded with 16mil fine pitch, BGA's and what ever else they could fit on the board.  The bottom side has chip resistors, caps, and 8 TQFP's.

> 

> My question is I was thinking about putting the board in a pallet to prevent warpage but I was concerned that the bottom side solder may be effected during the Top side reflow.  Normally bottom side components reach liquidus and then cool back down.  I was concerned using a pallet they solder on the bottom side might stay just below liquidus and create a plastic solder joint.  I have used pallets in the past only on hybrids.

> 

> Any help with this issue would be greatly appreciated!

> 

> Scott Lefebvre

> Process Engineer

> ADC

> > F    (530)265-1041

> > 8    (530)265-1012

> > *  [log in to unmask]

> >

> >

> >

> >

> >

> 

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