I have an new assembly that is 14"x18" & .093 thick loaded with 16mil fine pitch, BGA's and what ever else they could fit on the board.  The bottom side has chip resistors, caps, and 8 TQFP's.

My question is I was thinking about putting the board in a pallet to prevent warpage but I was concerned that the bottom side solder may be effected during the Top side reflow.  Normally bottom side components reach liquidus and then cool back down.  I was concerned using a pallet they solder on the bottom side might stay just below liquidus and create a plastic solder joint.  I have used pallets in the past only on hybrids.

Any help with this issue would be greatly appreciated!

Scott Lefebvre
Process Engineer
ADC
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