Hello everyone.....
One of the varied managers that I have to work for has asked me the question
of;

"Why do you need to have a 1mm gap between SMT component pads?"
"Can you get the components any closer?"

My default placement outline on SMT components is 0.5mm (making 1mm when
side by side), and
placing components this spaced works fine, but when you take apart a mobile
phone & see the placement on it
we have to wonder if we can go closer?

I'm sure that this is something that I have seen in the varied publications
that I have read, something
to do with preventing solder theft, thermal dissipation, preventing the
placement machine hitting adjacent components etc

Now as my reply determines the component pitch on what will be one of our
highest volume boards, I'd like to formulate
a very technical reply....

So have you folks got any good comments on why?

What can happen if I place them closer?
How close can I place components these days?

Incidentally we use Quad QSV1000 P&P and Reflow oven.

Many thanks...
Matthew Lamkin
Printed Circuit Board Draughtsman
Protec Fire Detection PLC.
Churchill Way,
Nelson, Lancashire,
England. U.K.
BB11 5JU.
TEL 01282 717393
FAX 01282 717273
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