DESIGNERCOUNCIL Archives

June 2001

DesignerCouncil@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Roger M. Stoops" <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Thu, 21 Jun 2001 08:40:12 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (37 lines)
Additional layers, more copper, added vias (to tie layers together),
external heatsink (attached by screws or thermally conductive
material/adhesive),  internal metal core ($$$).  However, you did not state
what kind of cooling you had in mind:  conductive, convection, or
convection w/forced air cooling?  Some forms of heat dissipation work
better than others, depending on the application.

Roger M. Stoops, C.I.D., PCB Designer


Trimble
Engineering and Construction Division



==============================================================
Hi All:

I am just wondering if anybody know how to improve heat dissipation on a
PCB.  That would include additional layers, more copper...

Any help is greatly appreciated

Thanks
Bouchra
P.S: For a Memory module

---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2