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June 2001

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Subject:	Plating Thickness
From:	Paul Noonan <[log in to unmask]>
Reply To:	DesignerCouncil E-Mail Forum.
Date:	Wed, 20 Jun 2001 16:45:04 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (22 lines)

Hi All
Just curious to know if most Designers include their own hole copper plating
thickness at say 25 or 30 Microns or what ever they feel that they require
on the manufacturing notes, or do most people prefer to just leave it at the
IPC specifications usually 20 Microns. I am just interested perhaps people
are designing boards that will have a lot or current flowing through them
and feel that 20 Microns is not quite enough.
Any comments on this?

Regards
Paul Noonan

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