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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 7 Jun 2001 15:09:01 -0400 |
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Several of my companies PCB's have traces running under components. For
Horizontal and Vertical Axial Leaded Components IPC-A-610 specifies a
minimum distance for the components to be above the board surface. Are
there any other "separation" guidelines for Traces Running Under Leaded
Components? In addition, we also have PCB's w/ traces running under surface
mount chip resistors and capacitors. Are there any "separation" guidelines
for surface mount? In particular, is there a guideline for the minimum
width of the ceramic substrate for a SM Chip Resistor or the insulation
characteristics of the substrate?
Any help would be greatly appreciated.
James J. Riling
Hardware Validation Engineer
Union Switch & Signal Inc.
Phone: (412)688-2926 Fax: (412)688-2398
Email: [log in to unmask]
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