Folks,

In this message, I ask Steve to tell me his requirements for posting
pictures to his site. The photos show component failure at my new contract
company.

Of primary concern is ESD/EOS failure. Also of concern is excessive thermal
excursions and the inability, possibly to get the heat out. Some reasons for
this conclusion involve coplanarity issues not allowing intimate contact
with the heat sink and the company's requirement of not filling the void
with thermal goop. Too messey they say.

My humble conclusion is the part is too ESD/EOS sensitive for the commercial
assembly operation hired to do the job. Contributing to the many failures is
the the thermal issue.

I appreciate any input from you component failure analysis folks. If you've
seen anything like this before, please let me know.

For now, this issue is secret with respect to the supplier (guess who as a
GaAs amplifier supplier) and the customer for it (my employee). Their
customer is one of the folks involved with, what else, broadband
communications.

The photos will be presented on Steve's site with his permission and
procedures. This might not happen until tomorrow, depending on available
time and resources.

Thanks,

MoonMan

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