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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 22 Jun 2001 13:01:30 -0400 |
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Hi all,
As part of our ISO-9001 effort we need to validate some of our processes.
Specifically wave solder, crimping, pwb cleaning and encapsulating. Did I
miss any?
To validate wave solder do I need to micro-section a sample board and look
at it with a microscope or SEM? If I have to micro-section a "sample"
board, how do I do that without destroying the pad I'm cutting through? Yet
another piece of equipment?
For crimps it would be a pull test. Any equipment suggestions?
For PWB cleaning it would be an ionic test. What equipment would be used?
For encapsulation it would have to be a destructive test to saw it apart and
inspect the cross section and maybe a hardness test to confirm that the
ratios provided the proper cure hardness.
I'm open to suggestions. Keep in mind that management will laugh if I bring
in requisitions for hundreds of thousands of dollars. We like the "keep it
simple" approach.
Thanks in advance.
Phil Nutting
Manufacturing Engineer
Kaiser Systems, Inc.
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