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June 2001

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TechNet <[log in to unmask]>
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Date:
Fri, 29 Jun 2001 11:41:25 EDT
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:
Re: Copper Plating Aluminum
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From:
"Phillip E. Hinton" <[log in to unmask]>
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Rudy

The non-electroless copper processes eliminate the chemical attack on the
aluminum during electroless copper process, but:
The Shadow or Black Hole processes work by coating all surfaces with a
conductive coating and then removing the conductive coating from all of the
metallic surfaces.
You are then back to trying to plate the aluminum with the acid copper
plating process.

Phil

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