Sender: |
|
Subject: |
|
From: |
|
Date: |
Fri, 22 Jun 2001 13:01:30 -0400 |
Content-Type: |
text/plain; charset="iso-8859-1" |
MIME-Version: |
1.0 |
Reply-To: |
|
Parts/Attachments: |
|
|
Hi all,
As part of our ISO-9001 effort we need to validate some of our processes.
Specifically wave solder, crimping, pwb cleaning and encapsulating. Did I
miss any?
To validate wave solder do I need to micro-section a sample board and look
at it with a microscope or SEM? If I have to micro-section a "sample"
board, how do I do that without destroying the pad I'm cutting through? Yet
another piece of equipment?
For crimps it would be a pull test. Any equipment suggestions?
For PWB cleaning it would be an ionic test. What equipment would be used?
For encapsulation it would have to be a destructive test to saw it apart and
inspect the cross section and maybe a hardness test to confirm that the
ratios provided the proper cure hardness.
I'm open to suggestions. Keep in mind that management will laugh if I bring
in requisitions for hundreds of thousands of dollars. We like the "keep it
simple" approach.
Thanks in advance.
Phil Nutting
Manufacturing Engineer
Kaiser Systems, Inc.
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|