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Tue, 12 Jun 2001 17:26:55 -0500 |
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I have an new assembly that is 14"x18" & .093 thick loaded with 16mil fine pitch, BGA's and what ever else they could fit on the board. The bottom side has chip resistors, caps, and 8 TQFP's.
My question is I was thinking about putting the board in a pallet to prevent warpage but I was concerned that the bottom side solder may be effected during the Top side reflow. Normally bottom side components reach liquidus and then cool back down. I was concerned using a pallet they solder on the bottom side might stay just below liquidus and create a plastic solder joint. I have used pallets in the past only on hybrids.
Any help with this issue would be greatly appreciated!
Scott Lefebvre
Process Engineer
ADC
> F (530)265-1041
> 8 (530)265-1012
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