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Mon, 18 Jun 2001 13:44:04 -0400 |
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Matthew,
We have be putting ground plane copper under MQFP-144 and other SMD ICs for
years with no apparent assembly problems or defects. One again, proper
oven profiling is important here. Also helps control EMI
emission/susceptability for the internal layers (if needed), has only a
small effect if board is designed properly.
Looking forward to 6 and 8 layers?
Roger M. Stoops, C.I.D., PCB Designer
Trimble
Engineering and Construction Division
5475 Kellenburger Rd.
Dayton, OH 45424-1099 USA
Ph: +01 937.233.8921 or +01 937.233.4574 ext 288
Fax: +01 937.233.7511
Matthew Lamkin
<matthew.lamkin@PROTEC-FIRE-DETECTI To: [log in to unmask]
ON.PLC.UK> cc:
Sent by: DesignerCouncil Subject: [DC] And another thing?
<[log in to unmask]>
06/14/01 09:01 AM
Please respond to "DesignerCouncil
E-Mail Forum."; Please respond to
Matthew Lamkin
Hello Again,
Should I (if there is room) place any groundplane (tied to 0v below)
underneath a MQFP208 chip, on the top copper/SMT side?
Or would this absorb some of the heat when it is being heated, and
consequently cause it to have poor solder connections?
(amongst all the other reasons for there being poor soldered joints ;-))
Matthew Lamkin.
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