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June 2001

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DesignerCouncil <[log in to unmask]>
Subject:
And another thing?
From:
Matthew Lamkin <[log in to unmask]>
Date:
Thu, 14 Jun 2001 14:01:38 +0100
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1.0
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"Cadstar Users group. (E-mail)" <[log in to unmask]>
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"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Matthew Lamkin <[log in to unmask]>
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Hello Again,

Should I (if there is room) place any groundplane (tied to 0v below)
underneath a MQFP208 chip, on the top copper/SMT side?

Or would this absorb some of the heat when it is being heated, and
consequently cause it to have poor solder connections?
(amongst all the other reasons for there being poor soldered joints ;-))

Matthew Lamkin.

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