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May 2001

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Subject:
Re: IPC standard for solder content on the back of PCBs?
From:
Kathy Kuhlow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 May 2001 13:30:45 -0500
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Can you put a photo out of the pad layout with the via connect?  That may help in determining any suggestions.  

TIA

Kathy




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<HTML><HEAD>
<META content="text/html; charset=iso-8859-1" http-equiv=Content-Type>
<META content="MSHTML 5.00.2614.3500" name=GENERATOR></HEAD>
<BODY style="FONT: 10pt Haettenschweiler; MARGIN-LEFT: 2px; MARGIN-TOP: 2px">
<DIV>Can you put a photo out of the pad layout with the via connect?&nbsp; That
may help in determining any suggestions.&nbsp; </DIV>
<DIV>&nbsp;</DIV>
<DIV>TIA</DIV>
<DIV>&nbsp;</DIV>
<DIV>Kathy</DIV></BODY></HTML>

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