I'm not sure what quantifies bad. Considering the component is only 0.5 mm
high and the peaks are about 2 to 3 times that height we may have a min.
clearance problem. I think Kathy & Ron's concern over a peak breaking off &
shorting are possible since our board is pretty densely populated & packaged
in it's final assembly. I'll looking at minimum clearance etc. to make a
final decision. Thanks to all you for your help.

Mike Di Giacomo, P.Eng.
Process Development Engineer

email: [log in to unmask]


-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Tuesday, May 01, 2001 8:16 AM
To: TechNet E-Mail Forum.; Mike Di Giacomo
Subject: RE: [TN] Solder Peaks...


Information on peaks is found in the 610 as solder projections. They have to
be pretty bad before they are a reason for rejection. They do indicate that
there is something going badly in the process. Hand soldering process
results like you describe might not be unreliable. Clearly, the results are
not target.

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Mike Di Giacomo
Sent: Monday, April 30, 2001 6:09 PM
To: [log in to unmask]
Subject: [TN] Solder Peaks...


Technet,

We have assembled SMT discrete components with solder peaks. Similar to
those seen on PTH leads. There is an IPC spec for max. height of a peak for
PTH leads of 1.5 mm (I'm pretty sure). Does anyone know of any such
allowance for SMT devices? We're building to class 3 spec. and I'm leaning
towards not accepting assemblies with these peaks as they were likely hand
soldered in place.

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