First, make sure pad surface is as clean as possible.
Second, try to use: Ni -- min 2.54 micrometer, Au -- min 0.05 micrometer.
Third, make sure nickel didn't become back pad (passivation ).
Hope this help.

Ben

----- Original Message -----
From: "Jorge Rodriguez" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, May 31, 2001 4:39 AM
Subject: [TN] Gold embrittlement


> We have a SMT connector with leads that have a minimum of 0.1 micrometers
of
> gold plating over 1.5 micrometers of nickel underneath. We don't know why
> the solder joint on this component, even though it looks OK,  breaks and
> fractures very easily. I suspect the gold is making the joint very brittle
> but I am not sure. We already checked the oven profile and it looks
alright.
> From all the components this is the only one we are having problems with.
> Any advice?. Is there a solder paste that help when gold plated components
> are used?
>
>
> Any advice would be appreciated.
>
>
> Jorge Rodriguez
> Process Engineer
> Varian Electronics Manufacturing
> E-mail: [log in to unmask]
>
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