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Subject:	Re: AW: [TN] Pad in Via for BGA's - Part II
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 31 May 2001 13:19:16 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (18 lines)

Hi Rush,
Vapor phase soldering was and is thew most elegant engineering solution to
soldering--no over-temperatures, no profiles, absolute temperature
uniformity. What killed this approach in the past was inadequate
equipment--thhis is no loger a problem.

Werner Engelmaier

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